Loops
Choose your chip design domain.
All-in-one Agentic AI platform for Physical AI and Silicon Development
Start from a physics-based surrogate model, application requirements, or a traditional chip specification—then move through architecture, RTL, verification, FPGA prototyping, firmware, software, ASIC tapeout, validation, and product delivery in one connected platform.
235
Published Agents
61
Published Apps
37
Prebuilt Workflows
12
Reference Journeys
5
Product Journeys
SDK + CLI + Studio
Developer Access
Choose Your Engineering Loop
One platform. Connected design loops. Shared engineering context.
Start with one Core loop. Add Advanced capability or more credits as your work grows.
One Connected Journey
Application Intelligence · Coming soonStart anywhere. Build the complete system.
ChipLoop turns your starting point into a clear path to deployment.
1UnderstandGoals and limits
2MatchBest model, if needed
3PartitionHardware and software
4ArchitectDefine the system
5Build & verifyCreate working IP
6DeployFPGA, ASIC, or product
Explore ChipLoop
Start where you need.
Products
Build complete chip journeys.
Apps
Run ready-made chip workflows.
Studio
Create custom agents and workflows.
Marketplace
Reuse approved engineering flows.
Self-regulated Silicon Workflows
ChipLoop can continue the journey and keep AI context focused.
HEM Automatic Runs moves from one passed stage to the next selected stage. Smart Context, ChipLoop's tokenmaxxing layer, selects the evidence that matters, while Agent Heatmap shows where tokens were spent across agents.
HEM Automatic Runs
When a stage passes, ChipLoop can continue to the next selected stage and keep each dashboard linked.
Smart Context + Agent Heatmap
ChipLoop ranks the right evidence before model calls, then shows per-agent input/output tokens so teams can see cost drivers and optimize workflows.
Evidence Stays Connected
Workflow IDs, artifacts, logs, answers, and handoffs stay traceable across the silicon journey.
Workflow Scale
Agent coverage grows with journey complexity.
As a chip journey grows from a digital IP block to mixed-signal products, tapeout, validation, and demos, ChipLoop keeps the agents, tools, artifacts, dashboards, and handoffs connected.
Physical AI
System
Analog
Digital
FPGA prototype
Firmware
Software + validation + co-sim
Product demo
Number of agents orchestrated
140100500
62
73
45
98
88
123
Application Intelligence Product
Ex: Application to FPGA or ASIC
Digital IP Product
Ex: PWM to demo
FPGA Prototype
Ex: PWM to bitstream
Mixed-Signal IP Product
Ex: Temp Monitor SoC
Digital IP + Tapeout
Ex: RTL to GDS/signoff
Mixed-Signal Product + Tapeout
Ex: SoC to demo + GDS
Workflows
Reusable Workflow Marketplace
Package engineering know-how into reusable chip design products.
ChipLoop turns individual agents and workflows into private apps, product journeys, and marketplace-ready solutions that other teams can run without rebuilding the environment.
Agents
Specialized AI and tool agents for chip tasks
Workflows
Reusable execution flows with saved context
Apps
Packaged workflows users can run or customize
Products
Connected journeys from requirement to handoff
Marketplace
Approved apps and products teams can reuse
Design Intent to Execution
ChipLoop turns complex multi-dimensional chip design workflows into connected, traceable execution loops.
01
Define
Specs, products, or workflows
→↓
02
Configure
Stages, tools, agents, goals
→↓
03
Run
Logs, dashboards, artifacts
Developer Automation
Automate from CLI, SDK, IDE, or GitHub
Use the same ChipLoop context in scripts, editors, CI, and private runners.
Available for scripted, local, and CI-driven workflows.
Install
pip install chiploop-sdkStart Building Connected Chip Workflows
Begin with the guided Arch2RTL demo, then continue through Products, Apps, or Studio.